EmQ-a50M1

AMD G-Series APU G-T40E Qseven® CPU Module

Key Features

Fanless Design
Soldered onboard AMD G-Series APU G-T40E dual-core
Integrated Gigabit Ethernet
Dual Channels 18/24-bit LVDS, Analog RGB, and DDI Port
Extended Operating Temp.: -20 ~ 70°C

EmQ-a50M1

System
CPU	Soldered onboard AMD G-Series APU G-T40E 1.0GHz
Memory	Soldered onboard 2GB DDR3L SDRAM
Chipset	AMD FCH A50M
BIOS	AMI UEFI BIOS
Watchdog Timer	1~255 levels reset

I/O Interface
USB Port	8 x USB 2.0 ports
Expansion Bus	3 x PCIex1, LPC
Storage	2 x Serial ATA ports 600MB/s HDD transfer rate 8GB NANDrive (OEM request)
Ethernet Chipset	1 x Realtek RTL8111E PCIe GbE controller
Audio	HD Audio link

Display
Graphics Chipset	Integrated AMD Radeon HD 6250
Graphics Interface	LCD: Dual Channels 18/24-bit LVDS Analog RGB (via RSV pin) 1 x DDI port

Mechanical & Environmental
Power Requirement	DC 5V, 5VSB
Power Consumption	[email protected] (Typical, with PBQ-3000)
Operating Temp.	-20 ~ 70ºC (-4 ~ 158ºF) with EmQ-a50M1 -20 ~ 60ºC (-4 ~ 149ºF) with EmQ-a50M1D
Operating Humidity	10 ~ 95% @ 70ºC with EmQ-a50M1 (noncondensing) 10 ~ 95% @ 60ºC with EmQ-a50M1D (noncondensing)
Dimension (L x W)	70 x 70 mm (2.76” x 2.76”)

Ordering Information
EmQ-a50M1	AMD G-T40E/ A50M Qseven® CPU module with 2GB memory soldered on CPU module
EmQ-a50M1D (OEM request)	AMD G-T40E/ A50M Qseven® CPU module with 2GB memory soldered on CPU module, 8GB NANDrive soldered on CPU module

Optional Accessories
HS-0520-F1	Heat spreader 70x65x8mm
HS-0000-W3	Universal evaluation heat sink kit with thermal pad 70x65x29.8mm, only used on a flat-type heat spreader
PBQ-3000	Qseven® R1.2 carrier board in EPIC form factor
CBK-06-3000-00	Cable kit 1 x USB cable 1 x USB2 cable 2 x Serial port cables 1 x SATA cable 1 x SATA power cable

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