AMD G-Series APU G-T40E Qseven® CPU Module

Key Features
  • Fanless Design
  • Soldered onboard AMD G-Series APU G-T40E dual-core
  • Integrated Gigabit Ethernet
  • Dual Channels 18/24-bit LVDS, Analog RGB, and DDI Port
  • Extended Operating Temp.: -20 ~ 70°C
  • Fanless
  • Wide Temperature -40°C~70°C
  • EmQ-a50M1
CPU Soldered onboard AMD G-Series APU G-T40E 1.0GHz
Memory Soldered onboard 2GB DDR3L SDRAM
Chipset AMD FCH A50M
Watchdog Timer 1~255 levels reset
I/O Interface
USB Port 8 x USB 2.0 ports
Expansion Bus 3 x PCIex1, LPC
Storage 2 x Serial ATA ports 600MB/s HDD transfer rate
8GB NANDrive (OEM request)
Ethernet Chipset 1 x Realtek RTL8111E PCIe GbE controller
Audio HD Audio link
Graphics Chipset Integrated AMD Radeon HD 6250
Graphics Interface LCD: Dual Channels 18/24-bit LVDS
Analog RGB (via RSV pin)
1 x DDI port
Mechanical & Environmental
Power Requirement DC 5V, 5VSB
Power Consumption [email protected] (Typical, with PBQ-3000)
Operating Temp. -20 ~ 70ºC (-4 ~ 158ºF) with EmQ-a50M1
-20 ~ 60ºC (-4 ~ 149ºF) with EmQ-a50M1D
Operating Humidity 10 ~ 95% @ 70ºC with EmQ-a50M1 (noncondensing)
10 ~ 95% @ 60ºC with EmQ-a50M1D (noncondensing)
Dimension (L x W) 70 x 70 mm (2.76” x 2.76”)
Ordering Information
EmQ-a50M1 AMD G-T40E/ A50M Qseven® CPU module with 2GB memory soldered on CPU module
EmQ-a50M1D (OEM request) AMD G-T40E/ A50M Qseven® CPU module with 2GB memory soldered on CPU module,
8GB NANDrive soldered on CPU module
Optional Accessories
HS-0520-F1 Heat spreader 70x65x8mm
HS-0000-W3 Universal evaluation heat sink kit with  thermal pad 70x65x29.8mm, only used on a flat-type heat spreader
PBQ-3000 Qseven® R1.2 carrier board in EPIC form factor
CBK-06-3000-00 Cable kit
1 x USB cable
1 x USB2 cable
2 x Serial port cables
1 x SATA cable
1 x SATA power cable

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