EmQ-v900
VIA Nano™ Qseven® CPU Module
Key Features
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Soldered onboard VIA Nano™ U3500 Processor
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Integrated Gigabit Ethernet
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Soldered onboard 1GB DDR3 SDRAM
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Single Channel 24-bit LVDS and DisplayPort
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RAID 0, 1 supported
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Extended Operating Temp.: -20 ~ 70°C
| System | |
| CPU | Soldered onboard VIA Nano™ U3500 1.0GHz Processor |
| Memory | Soldered onboard 1GB DDR3 SDRAM |
| Chipset | VIA VX900 |
| BIOS | AMI PnP Flash BIOS |
| Watchdog Timer | 1~255 levels reset |
| I/O Interface | |
| USB Port | 8 x USB 2.0 host (1 x configurable as client) |
| Expansion Bus | 2 x PCIex1, SDIO |
| Storage | 2 x Serial ATA ports with 300MB/s HDD transfer rate; RAID 0, 1 supported |
| Ethernet Chipset | 1 x Realtek PCIe RTL8111 GbE controller |
| Audio | HD Audio link |
| Display | |
| Graphics Chipset | Integrated Chrome9™ HD DX9 controller |
| Graphics Interface | LCD: Single Channel 24-bit LVDS, resolution up to 1366 x 768 DisplayPort |
| Mechanical & Environmental | |
| Power Requirement | DC 5V, 5VSB |
| Power Consumption | [email protected] (Typical, with PBQ-3000) |
| Operating Temp. | -20 ~ 70ºC (-4 ~ 158ºF) |
| Operating Humidity | 10 ~ 95% @ 70ºC (non-condensing) |
| Dimension (L x W) | 70 x 70 mm (2.76” x 2.76”) |
| Ordering Information | |
| EmQ-v900 | VIA Nano™ U3500 Qseven® CPU module with 1GB memory soldered on CPU module |
| Optional Accessories | |
| HS-v900-F1 | Heat spreader 69.3x67x6mm |
| HS-0000-W3 | Universal evaluation heat sink kit with thermal pad 70x65x29.8mm, only used on a flat-type heat spreader |
| PBQ-3000 | Qseven® R1.2 carrier board in EPIC form factor |
| CBK-06-3000-00 | Cable kit 1 x USB cable 1 x USB2 cable 2 x Serial port cables 1 x SATA cable 1 x SATA power cable |
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