EmQ-iX702

Intel® Amston Lake Qseven R2.1 CPU Module
EmQ-iX702
EmQ-iX702

EmQ-iX702

Intel® Amston Lake Qseven R2.1 CPU Module
Hauptmerkmale
  • Soldered onboard Intel Amston lake SoC Processor
  • Soldered onboard LPDDR5 4GB/8GB/16GB SDRAM
  • Integrated 1 Gigabit Ethernet Controller
  • Dual Channel 24-bit LVDS and 1 x DDI port
  • Compliant with Qseven specifications revision 2.1
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Technische Daten

System

CPU Soldered onboard Intel® Atom® x7211RE 1.0GHz/3.2GHz(Turbo)
Dual cores TDP 6W
Atom® x7433RE 1.5GHz/3.5GHz(Turbo)
Quad cores TDP 9W
Memory Soldered onboard LPDDR5 4800MT/s 4GB / 8GB / 16GB
BIOS AMI UEFI BIOS
TPM Support TPM 2.0

I/O

USB Port 6 x USB 2.0 ports
2 x USB 3.2 ports
Serial Port 1 x UART
Expansion Bus 4 x PCIex1 Gen3 lanes, I2C, SMBus, SPI
Storage 2 x SATA 3.0 ports
Soldered onboard eMMC 5.1 (OEM Request)
Ethernet Chipset 1 x Intel® i210 Ethernet controller
Audio HD link

Display

Graphics Chipset Integrated in Intel® Gen12 graphic
Graphics Interface Dual Channel 24-bit LVDS, with resolution up to 1920x1200
1 x DDI port supports HDMI 2.0b or DP1.4 or eDP1.4b with resolution up to 4096x2304@60HZ

OS support

Windows 10/11 64-bit
Linux: Ubuntu

Mechanical & Environmental

Power Requirement DC 5V, 5VSB
Operating Temp. -40 ~ 85°C (-40 ~ 185°F)
Operating Humidity 10 ~ 95% @ 85°C (non-condensing)
Dimension (L x W) 70 x 70 mm (2.76” x 2.76”)

Ordering Information

EmQ-iX702-WT-x7211RE-4G Qseven R2.1 Intel® Amston Lake ATOM x7211RE CPU Module w/4G memory down, -40~85°C
EmQ-iX702-WT-x7433RE-8G Qseven R2.1 Intel® Amston Lake ATOM x7433RE CPU Module w/8G memory down, -40~85°C
Zubehör

Optional Accessories

HS-X702-F1 Heat Spreader
PBQ-900R Qseven R2.1 ATX form factor carrier board (All Super IO port functions are OEM requested)
CBK-02-900R-00 Cable kit
Download
Beschreibung Größe Typ Version Datum Download
Beschreibung
EmQ-iX702 Datasheet
Größe
-
Typ
pdf
Version
Datum
2025-01-21
Download
Download
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