COMX-A300

Intel® Core™ Ultra processors (Arrow Lake/Meteor Lake U/H) CPU, COM-HPC Client Size A Module
New

COMX-A300

Intel® Core™ Ultra processors (Arrow Lake/Meteor Lake U/H) CPU, COM-HPC Client Size A Module
New
Features
  • COM-HPC® Client Size A Module
  • Intel® Core™ Ultra Processor (Arrow Lake/Meteor Lake U/ H-series)
  • Intel® Xe LPG graphic up to 128EU, 4 independent 4K display
  • Dual-CH DDR5 up to 96GB 6400MT/s SO-DIMM
  • Support Max. 4 independent displays
  • 8.5V~20V Wide Range Voltage Input
  • Multiple I/O expansion: 2.5GbE, PCIe Gen5, USB4 & USB3.2 Gen2, SATA3.0
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Product Highlight
ARBOR COMX-A300 - Exceptional Edge AI Vision Compute Power

Exceptional Edge AI Vision Compute Power

The COMX-A300 features a powerful heterogeneous computing core designed for AI inference and real-time data processing. It can handle multiple high-resolution video streams instantly in demanding edge environments. It is perfectly suited for complex AI applications, such as industrial defect detection, smart traffic analysis, and autonomous robotics. It ensures high throughput and ultra-low latency.


ARBOR COMX-A300 - Precise and Efficient High-Bandwidth I/O

Precise and Efficient High-Bandwidth I/O

The COMX-A300 module provides precise and efficient I/O expansion capabilities with 8 PCIe Gen 5 lanes and up to 2 USB 4.0 ports. These high-bandwidth interfaces are designed to effortlessly connect to advanced sensors, high-speed cameras, and network modules, providing robust connectivity and throughput for data-intensive applications.


ARBOR COMX-A300 - COM-HPC Client Type Standardization Advantage

COM-HPC Client Type Standardization Advantage

Adopting the COM-HPC Client Type specification protects the customer's carrier board design investment in the long term. This standardization and modularity allow system integrators (SIs) and original equipment manufacturers (OEMs) to significantly mitigate development risks, eliminating the need to redesign the carrier board when upgrading the computing core in the future. This substantially expedites product rollout.

Specification

System

CPU Intel® Core™ Ultra Series 2 Processor
Core Ultra 7 255H / 255U / 155H/ 155U
Core Ultra 5 255H / 255U / 125H/ 125U
Memory 2 x 262-pin DDR5 SO-DIMM sockets, supporting up to 96GB 6400 MHz SDRAM
Graphics Intel® ARC (H only) Xe LPG+ graphics
Graphic Interface 3 x DDI ports and 1 eDP
SATA 2 x SATA (share with PCIe)
LAN Chipset 2 x Intel® I226LM 2.5GbE controllers
Watchdog Timer 1~255 levels reset
TPM Onboard TPM 2.0

I/O

Serial Port GPIO: 12 bit GPIO (default 6 input / 6 output)
I2C Baud Rate: 400KHz
SMBus Baud Rate: 100KHz
UART TX/RX signal only
USB Ports 2x USB4
2x USB 3.2 Gen2
8x USB 2.0
LAN 2 x Ethernet with TSN & WOL support

I/O

Audio 2 x Soundwire
Supports HD link or I2S or 2 x Soundwire
Expansion Bus 4 x PCIEx1 Gen4 (Lane 0-3), configurable to x1, x2, x4
2 x PCIEx4 Gen4 (Lane 4-7, 8-11)
1 x PCIEx4 Gen4 (Lane 12-15) shared with optional onboard NVMe
4 x PCIEx1 Gen4 (Lane 16-19), *BOM optional and configurable to x1, x2, x4
1 x PCIEx8 Gen5 (Lane 32-39), Processor H only

OS support

System Windows® 10 IoT Enterprise 64-bit / Windows® 11 IoT Enterprise 64-bit, Linux (Ubuntu 20.04)

Mechanical & Environmental

Power Requirement 8.5V~20V wide range voltage input, +5VSB
Operating Temp. -20 ~ 60°C (-4 ~ 140°F)
Storage Temp. -40 ~ 85°C (-40~ 185°F)
Operating Humidity 10 ~ 95% @60°C (non-condensing)
Dimension
(W x H x D)
95 x 120 mm (3.74” x 4.72”)
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Description
Size
-
Type
pdf
Version
Date
2025-10-22
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