COMX-A300

Intel® Core™ Ultra Processors Series 2 (Arrow Lake U/H) CPU, COM-HPC Client Size A Module

COMX-A300 High-Performance COM-HPC Module with Intel® Core™ Ultra for Edge AI Computing

Intel® Core™ Ultra Processors Series 2 (Arrow Lake U/H) CPU, COM-HPC Client Size A Module
Features
  • COM-HPC® Client Size A Module
  • Intel® Core™ Ultra Processor Series 2(Arrow Lake U/ H)
  • Intel® Xe LPG graphic up to 128EU, 4 independent 4K display
  • Dual-CH DDR5 up to 128GB 6400MT/s SO-DIMM
  • Support Max. 4 independent displays
  • Wide Range Voltage Input: 8V~20V
  • Multiple I/O expansion: 2.5GbE, PCIe Gen5, USB4 & USB3.2 Gen2, SATA3.0 and MIPI_CSI
Product Highlight
ARBOR COMX-A300 - Exceptional Edge AI Vision Compute Power

Exceptional Edge AI Vision Compute Power

The COMX-A300 features a powerful heterogeneous computing core designed for AI inference and real-time data processing. It can handle multiple high-resolution video streams instantly in demanding edge environments. It is perfectly suited for complex AI applications, such as industrial defect detection, smart traffic analysis, and autonomous robotics. It ensures high throughput and ultra-low latency.


ARBOR COMX-A300 - Precise and Efficient High-Bandwidth I/O

Precise and Efficient High-Bandwidth I/O

The COMX-A300 module provides precise and efficient I/O expansion capabilities with 1 PCIe Gen 5 and up to 2 USB 4.0 ports. These high-bandwidth interfaces are designed to effortlessly connect to advanced sensors, high-speed cameras, and network modules, providing robust connectivity and throughput for data-intensive applications.


ARBOR COMX-A300 - COM-HPC Client Type Standardization Advantage

COM-HPC Client Type Standardization Advantage

Adopting the COM-HPC Client Type specification protects the customer's carrier board design investment in the long term. This standardization and modularity allow system integrators (SIs) and original equipment manufacturers (OEMs) to significantly mitigate development risks, eliminating the need to redesign the carrier board when upgrading the computing core in the future. This substantially expedites product rollout.

Specification

System

CPU Onboard Intel® Core™ Ultra Processor Series 2
Core Ultra 7 255H / 255U
Core Ultra 5 255H / 255U
Memory 2 x 262-pin DDR5 SO-DIMM sockets, supporting up to 128GB 6400 MT/s
Graphics Intel® ARC (H only) Xe LPG+ graphics
Graphic Interface 3 x DDI ports and 1 x eDP
SATA 2 x SATA (share with PCIe)
LAN 2 x Intel® I226LM 2.5GbE controllers
Watchdog Timer 1~255 levels reset
TPM dTPM 2.0

I/O

Serial Port GPIO: 12 bit GPIO (default 6 input / 6 output)
I2C Baud Rate: 400KHz
SMBus Baud Rate: 100KHz
2 x UART TX/RX signal only
2 x MIPI CSI
1 x Debug Port
USB 2x USB4
2x USB 3.2 Gen2
8x USB 2.0
LAN 2 x Ethernet with TSN & WOL support
Audio Bus Supports HD link or I2S or 2 x Soundwire

I/O

Expansion Bus 4 x PCIe x1 Gen4 (Lane 0-3), configurable to x1, x2, x4
2 x PCIe x4 Gen4 (Lane 4-7, 8-11)
1 x PCIe x4 Gen4 (Lane 12-15) shared with optional onboard NVMe
4 x PCIe x1 Gen4 (Lane 16-19), *BOM optional and configurable to x1, x2, x4
1 x PCIe x8 Gen5 (Lane 32-39), Processor H only

OS support

System Windows® 10 IoT Enterprise 64-bit
Windows® 11 IoT Enterprise 64-bit
Linux (Ubuntu 20.04)

Mechanical & Environmental

Power Requirement 8V~20V wide range voltage input, +5VSB
Operating Temp. -20°C ~ 60°C (-4°F ~ 140°F)
Storage Temp. -40°C ~ 85°C (-40°F ~ 185°F)
Operating Humidity 10 ~ 95% @60°C (non-condensing)
Dimension 95 x 120 mm (3.74” x 4.72”)

Ordering Information

COMX-A300-255H Intel Core Ultra 7 processor 255H COM-HPC Client Size A CPU Module
COMX-A300-225H Intel Core Ultra 7 processor 225H COM-HPC Client Size A CPU Module
COMX-A300-255U Intel Core Ultra 5 processor 255U COM-HPC Client Size A CPU Module
COMX-A300-225U Intel Core Ultra 5 processor 225U COM-HPC Client Size A CPU Module
HS-A300-F1-T Heat spreader; 95*120*13mm, W/ THREADED, W/PAD, OEM request
HS-A300-F1-NT Heat spreader; 95*120*13mm,THROUGH HOLE, W/PAD
HS-A300-C1 Heat sink 95*120 mm, W/FAN+PAD
PBH-1200 COM-HPC Client evaluation carrier board in ATX or AT form factor
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Date
2026-03-26
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