FPC-5210 Series

Intel® 12th Gen. CoreTM Embedded GPU Computer supporting Nvidia® RTX-A4500

FPC-5210 Series

Intel® 12th Gen. CoreTM Embedded GPU Computer supporting Nvidia® RTX-A4500
Features
Coming Soon
  • SMART FAN support
  • 12th Generation CoreTM i9/i7/i5/i3 Processor (Alder Lake-S)
  • Up to 120W GPU MXM module expansion
  • 802.3af (15.4W) / 802.3at(25.5W) Gigabit PoE ports
  • Wide range DC power input (9~36V)
  • DP x2 + HDMI x 1 and DVI x 1 (support 4 independent displays)
  • Power on/off delay control / configurable ignition power control
  • Supports TPM 2.0 and Time-Sensitive Networking (TSN)
  • Two-mPCIe for optional WiFi/3G/4G/GPS or I/O expansion supported
  • 1 x M.2 B-Key for storge or 5G / LTE +1 x M.2 E-Key for WiFi / BT
  • 1 x M.2 M-Key for NVMe SSD
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Specification

System

CPU Intel® 12th generation Core™ i9/i7/i5/i3 Processor in LGA1700 socket
Memory 2 x 262-pin DDR5 SO-DIMM sockets, supporting 4800 MHz SDRAM up to 64GB
Chipset Intel® R680E
Graphics Integrated Intel® HD Graphics 770
ATA 2 x Serial ATA ports with 600MB/s HDD transfer rate
LAN Chipset
FPC-5210-2M4/
FPC-5210-2P4
1 x Intel® I219LM GbE controller w/ iAMT 16.0
3 x Intel® I226 2.5GbE controllers
2 x Intel® I226 2.5GbE controllers for PoE
2 x Marvell® 10GbE controllers for PoE
LAN Chipset

FPC-5210-M4

1 x Intel® I219LM GbE controller w/ iAMT 16.0
3 x Intel® I226 2.5GbE controllers
2 x Inte® I210 GbE controllers for PoE
2 x Intel® I226 2.5GbE controllers for PoE
Watchdog Timer 1~255 levels reset
TPM Infineon SLB9670 supports TPM 2.0

I/O Interface

Serial Port 2 x RS-232/422/485 configurable ports via DB-9 connectors (Default RS232,Switch via BIOS)
2 x RS-232 ports via DB-9 connectors
USB Port 8 x USB 3.2 Gen2 ports
LAN Port FPC-5210-2M4 4 x RJ-45 connectors for GbE
4 x M12 X-coded connectors by
2 x Intel® I226(2.5GbE) +
2 x Marvell® 10GbE, max 60W
supports 802.3at POE+
LAN Port FPC-5210-2P4 4 x RJ-45 connectors for GbE
4 x RJ-45 connectors by
2 x Intel® I226(2.5GbE)+
2 x Marvell® 10GbE, max 60W
supports 802.3at POE+
LAN Port FPC-5210-M4 4 x RJ-45 connectors for GbE
4 x M12 X-coded connectors by
2 x Intel® I210(1GbE) +
2 x Intel® I226(2.5GbE) supports 802.3af POE
Video Port 2 x DP 1.4a from MXM module or Intel Graphics
1 x HDMI 2.0b female connector
1 x DVI-I female connector for digital/analog video output
* Support 4 independent displays
DIO Port 1 x DB15 connector for 8 x digital input ( Dry/ Wet contact ) with 2KV isolation
1 x DB15 connector for 8 x digital output with 2KV isolation
Expansion Bus 1 x Mini-card socket interconnected with SIM card socket for optional Wi-Fi or LTE module(Full size)
1 x SIM socket/1 x CFast socket (outside accessible)
Selectable Port 1 x DB25 connector for DIO (8 in/8 out) port or LPT port (either one, default is DIO)
Audio Mic-in/Line-out
Expansion Bus 1x MXM3.1 TYPE A/B GPU Slot (PCIe Gen5 x16) MXM A4500 Support
2 x mini-PCI Express Slots interconnected with SIM card sockets
for optional WiFi/BT/3G/LTE/GPS (PCIex1+USB2.0, Full Size)
3 x SIM socket ( 2 for mPCIe / 1 for M.2 B key )
1 x M.2 B key (2242/3052/2280) w/(PCIex2+USB3.0+SATA ) interconnected with
SIM for 5G / LTE or for storage (either one)
1 x M.2 E key (2230) with PCIex1+USB2.0+CNVi) for Wireless

Environmental

Operating Temp. -20 ~ 55°C (-4 ~ 131°F), ambient w/ air flow (w/ 65W TDP CPU,115W GPU)
Storage Temp. -40 ~ 85°C (-40 ~ 185°F)
Operating Humidity 10 ~ 95% @ 55°C (non-condensing)
Vibration 5~500Hz 2G rms X,Y,Z axis w/SSD, according to IEC 60068-2-64
Shock 30 Grms, Half-sine 11 m sec. duration w/ SSD, according IEC60068-2-27

Qualification

Certification CE, FCC Class A

Power Requirement

Power Input DC 9~36V input ( w/ 4-pin DC input terminal block) ( V+ ,V+, V-, V-)
Ignition Switch 2-pin teminal block : IGN, GND
Power Consumption Max. 280W

Storage

Type 2 x 2.5” outside accessible drive bays
1 x M.2 B key ( 2242/2280 ) w/ (PCIex2+USB+ SATA ) for storage or LTE expansion ( either one)
1 x M.2 2280 M key supports 2242,2280 devices (PCIe x4 & SATA signal, support boot up function)

Mechanical

Construction Metal
Mounting Wall-mount
Weight 4.68 Kg (10.32lb)
Dimensions (W x D x H) 285 x 230 x 130mm (11.2” x 9.05” x 5.12”)

OS Support

Windows 10 IOT Enterprise 64-bit Linux ( Ubuntu 20.04 )

Ordering Information

FPC-5210-2M4 Embedded GPU Computer, Bare BOM, w/2x 10GbE POEs, M12 type
FPC-5210-2P4 Embedded GPU Computer, Bare BOM, w/2x 10GbE POEs, RJ45 type (BTO)
FPC-5210-M4 Embedded GPU Computer, Bare BOM, w/4x M12 POEs
Accessories

Standard Accessories

  • CPF-92Q0-C1
    CPU Cooling for LGA1700 CPU

Optional Accessories

  • WMK-5210
    Wall-mount kit for FPC-521x Series
  • PAC-330W6B
    330W AC/DC adapter kit w/ 4-pin terminal block

Optional Configuration (CTOS* Kit)

  • MXM-KIT-A4500-8GB
    MXM 3.1 Type B NVIDIA® Quadro® Embedded A4500-8GB GDDR6 MXM Kit with Heatsink
  • MXM-KIT-A4500-16GB
    MXM 3.1 Type B NVIDIA® Quadro® Embedded A4500-16GB GDDR6 MXM Kit with Heatsink
  • MXM-KIT-A2000-8GB
    MXM 3.1 Type A NVIDIA® Quadro Embedded A2000-8GB MXM Kit with Heatsink
  • MM-5C-8G/16G/32G
    DDR5-4800 8GB/16GB/32G SDRAM DIMM module
  • WIFI-IN2550
    Intel AX200NGW M.2 Wi-Fi 6 module w/2x30cm internal wires
  • ANT-H11
    1 x 2dBi HSUPA antenna
  • ANT-D11
    1 x WiFi dual-band 2.4G/5G antenna
  • CoreTM i9-12900E
    Intel® 12th Gen. CoreTM i9-12900E processor, L3/30M, 2.3G
  • CoreTM i9-12900TE
    Intel® 12th Gen. CoreTM i9-12900TE processor, L3/30M, 1.1G
  • CoreTM i7-12700E
    Intel® 12th Gen. CoreTM i7-12700E processor, L3/25M, 2.1G
  • CoreTM i7-12700TE
    Intel® 12th Gen. CoreTM i7-12700TE processor, L3/25M, 1.4G
  • CoreTM i5-12500E
    Intel® 12th Gen. CoreTM i5-12500E processor, L3/18M, 2.9G
  • CoreTM i5-12500TE
    Intel® 12th Gen. CoreTM i5-12500TE processor, L3/18M, 1.9G
  • CoreTM i3-12100E
    Intel® 12th Gen. CoreTM i3-12100E processor, L3/12M, 3.2G
  • CoreTM i3-12100TE
    Intel® 12th Gen. CoreTM i3-12100TE processor, L3/12M, 2.1G
  • *CTOS means Configure-to-Order Service.
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Description
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Version
Date
2022-11-01
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Description
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Type
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Version
Date
2022-11-15
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